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Atomic Layer Deposition

Atomic Layer Deposition (ALD) is a precise thin-film coating technique used to create ultra-thin layers of materials one atom at a time. It involves alternating exposure of a substrate to different chemical gases, allowing for a controlled growth of material. This process is commonly used in various industries, including electronics, to fabricate components like microchips and sensors. ALD ensures uniform coverage even on complex shapes and allows for fine-tuning of material properties, making it essential in advanced manufacturing and nanotechnology.

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    Atomic Layer Deposition (ALD) is a precise manufacturing process used to create very thin films of materials, layer by layer, at the atomic scale. It involves alternating exposure of a surface to different chemical gases, which react to form a single atomic layer before the next layer is added. This technique allows for exceptional control over thickness and uniformity, making it ideal for applications in electronics, solar cells, and nanotechnology. ALD is valued for its ability to coat complex shapes and provide excellent conformality, ensuring that every part of a device is effectively covered.