ALD CVD (Chemical Vapor Deposition)

Atomic Layer Deposition (ALD) and Chemical Vapor Deposition (CVD) are techniques used to create thin films on surfaces. ALD deposits materials one atomic layer at a time, allowing for precise control over thickness and uniformity, ideal for nanotechnology and semiconductor fabrication. CVD, on the other hand, involves chemical reactions that deposit material onto a surface in a continuous flow, making it suitable for larger-scale applications. Both methods are essential in industries like electronics and renewable energy, where the quality of thin films is crucial for performance and efficiency.