International Conference on Atomic Layer Deposition

The International Conference on Atomic Layer Deposition (ALD) is a global gathering of scientists and engineers focused on a precise technology used to create ultra-thin, uniform coatings on surfaces. ALD involves depositing materials atom-by-atom, allowing for exceptional control over film thickness and composition. This technology is vital in industries like electronics, energy, and healthcare for manufacturing advanced devices such as microchips and sensors. The conference fosters knowledge exchange, showcasing the latest research, innovations, and applications in ALD, promoting collaboration to solve technological challenges and advance material science.