ALD (Atomic Layer Deposition)

Atomic Layer Deposition (ALD) is a precise method used to create thin films of material, one atomic layer at a time. This technique involves alternating exposure of a surface to different chemical gases. Each gas reacts with the surface to deposit a single layer, ensuring uniformity and control over thickness. ALD is widely used in industries like semiconductor manufacturing and coatings, allowing for the production of advanced materials with exceptional properties, such as better electrical performance and increased durability. Its ability to coat complex shapes and structures makes it a crucial technology in modern material science.