Plasma-Enhanced ALD

Plasma-Enhanced Atomic Layer Deposition (PEALD) is a technique used to create very thin layers of materials, atom by atom, on a surface. It combines traditional atomic layer deposition with plasma technology, which generates highly reactive particles. This enhances the process, allowing for better control over the layer's thickness and properties. PEALD is valuable in producing coatings for electronics, semiconductors, and other advanced materials, enabling precise fabrication and improving performance while minimizing waste. Its ability to operate at lower temperatures also broadens the types of materials that can be used.