Plasma Enhanced Chemical Vapor Deposition (PECVD)

Plasma Enhanced Chemical Vapor Deposition (PECVD) is a technology used to create thin films of materials on surfaces. It involves using plasma, a state of matter made of charged particles, to enhance chemical reactions. In PECVD, gases are introduced into a vacuum chamber, and the plasma breaks these gases down into reactive species. These species then deposit a thin layer of material—like silicon or silicon nitride—onto a substrate. This method is commonly used in industries like electronics and solar energy to produce high-quality coatings with precise properties for various applications.