PECVD

PECVD, or Plasma-Enhanced Chemical Vapor Deposition, is a process used to deposit thin films of materials onto surfaces. It uses a plasma—an energized state of gases—that activates chemical reactions at relatively low temperatures. This enables the coating of substrates with materials like silicon or insulation layers efficiently and precisely. PECVD is widely used in electronics manufacturing, such as in making semiconductor devices, solar panels, and protective coatings, because it offers good control over film quality and properties while being energy-efficient and suitable for complex-shaped surfaces.