reactive ion etching

Reactive Ion Etching (RIE) is a precise process used in manufacturing micro and nanoscale devices, like computer chips. It involves placing the material to be etched into a vacuum chamber and introducing reactive gases. Radiofrequency energy energizes these gases into plasma, creating reactive ions and radicals. These reactive particles selectively remove material from targeted areas by chemical reactions and physical bombardment, allowing for very detailed and controlled shaping of surfaces. RIE combines chemical activity with ion bombardment, resulting in clean, anisotropic etching patterns essential for advanced electronics and microfabrication.