Depth Profiling Techniques

Depth profiling techniques analyze the composition of a material layer by layer, providing detailed information about its structure. Methods like Secondary Ion Mass Spectrometry (SIMS) use a focused ion beam to sputter the surface, removing layers sequentially while analyzing each for its chemical makeup. Similarly, X-ray Photoelectron Spectroscopy (XPS) can be combined with ion sputtering to reveal composition variations at different depths. These techniques are essential for understanding thin films, coatings, and layered materials in electronics, coatings, and materials science, offering insights into how materials are built up internally without destroying the entire sample.