wafer bonding

Wafer bonding is a process used in manufacturing advanced electronic devices, where two flat silicon wafers are joined together to form a single, integrated structure. This is achieved by bringing the wafers into close contact and using techniques such as adhesives, surface treatments, or precise pressure and heat to create a strong, permanent bond. This method allows engineers to combine different functions or materials on separate wafers, enabling the production of complex microelectronics like sensors, memory chips, or multi-layered circuits, ultimately enhancing device performance and versatility.