Uniaxial Sputter Coating

Uniaxial sputter coating is a process used to deposit thin, even layers of material onto a surface. It involves placing a target material inside a vacuum chamber and using a high-energy gas (like argon) to eject atoms from the target. These atoms travel in a mostly straight line (uniaxial direction) towards the object being coated, creating a uniform film. This method ensures precise control over the composition and thickness of the coating, commonly used in manufacturing electronics, optical devices, and protective coatings to enhance durability or functionality.