System-in-Package (SiP)

System-in-Package (SiP) is a technology where multiple electronic components, such as microchips, memory, and sensors, are assembled together inside a single, compact package. This integration allows different parts to work together closely, saving space and improving performance. Think of it as combining several small devices into one unified unit, similar to a multi-tool. SiP is used in smartphones, wearables, and other small electronics to make devices more powerful, energy-efficient, and reliable, all while maintaining a compact design.