micromechanical cleavage

Micromechanical cleavage is a precise process used to peel very thin layers from a larger material, typically a crystal like silicon. It involves applying controlled mechanical force—often with tools like adhesive tape—to gently lift off a thin sheet from the bulk material. This technique allows scientists and engineers to produce ultra-thin membranes or layers necessary for advanced electronic devices and research. Despite its simplicity, it enables the creation of remarkably thin and high-quality layers, essential for studying material properties at the nanoscale.