float-zone technique

The float-zone technique is a precise method for growing high-quality single crystal ingots, often used in semiconductor manufacturing. It involves melting a small region of a polycrystalline rod with focused heat, then gradually moving this molten zone along the rod length. As the molten zone advances, the crystal structure realigns and purifies itself, resulting in a uniform, defect-free single crystal. This method avoids contact or contamination from crucibles, ensuring the crystal's purity and structural integrity, which are essential for electronic devices like silicon wafers.