DRIE systems

DRIE (Deep Reactive Ion Etching) is a precise manufacturing process used to carve very deep, narrow features into silicon wafers. It employs plasma—a charged, ionized gas—that actively etches away material, allowing for highly accurate and vertical sidewalls. Widely used in microfabrication for making microelectromechanical systems (MEMS), sensors, and advanced electronics, DRIE provides deep, clean etching without damaging the surrounding material. This technology enables the creation of intricate, three-dimensional microstructures essential in modern device manufacturing.