Dicing techniques

Dicing techniques involve precisely cutting a large piece of material, like silicon or glass, into smaller, functional chips or segments. This process uses specialized equipment such as diamond-tipped saws, lasers, or blades to make accurate, clean cuts without damaging the material. The goal is to separate the finished product into individual components for electronics, medical devices, or other applications. Proper dicing ensures high-quality, reliable parts by minimizing chipping, cracking, or imperfections during the separation process. It’s an essential step in manufacturing high-tech devices, balancing precision, efficiency, and material integrity.