deep reactive ion etching (DRIE)

Deep reactive ion etching (DRIE) is a precise manufacturing process used to carve deep, narrow trenches into silicon or other materials. It involves using high-energy ions generated in a plasma to selectively remove material in specific areas, enabling the creation of complex, high-aspect-ratio structures. The process alternates between etching and passivation steps, which protect sidewalls and allow deep, vertical cuts with minimal damage. DRIE is essential in producing advanced microelectronics, MEMS devices, and other tiny structures with high accuracy and smooth surfaces.