CVD and ALD Techniques

CVD (Chemical Vapor Deposition) and ALD (Atomic Layer Deposition) are methods used to coat surfaces with thin, uniform layers of materials. In CVD, gases react at high temperatures to form a solid film on a substrate, enabling rapid and uniform coating over large areas. ALD, on the other hand, involves sequential, self-limiting chemical reactions that deposit very precise, ultra-thin layers one atom at a time, offering exceptional control and conformality, especially on complex shapes. Both techniques are essential in semiconductor manufacturing, electronics, and nanotechnology for building advanced, reliable components.