capacitively coupled plasma

Capacitively coupled plasma (CCP) is a method used to generate plasma—an energized state of matter with free electrons and ions—by applying an electric field between two electrodes separated by a dielectric layer. This setup creates an oscillating electric field that ionizes a gas, producing plasma without physically contacting the material being processed. CCP is commonly used in manufacturing, such as in semiconductor fabrication, because it allows precise control over plasma density and energy, enabling clean surface modifications, etching, or coating processes with minimal damage to the substrate.