3D Packaging

3D packaging refers to stacking or closely integrating multiple electronic components of a device vertically, rather than placing them side by side on a circuit board. This approach allows for a smaller, more compact design and can improve performance by shortening the distance between components. It involves technologies like stacking chips (known as 3D ICs) and connecting them with tiny vertical connections called through-silicon vias (TSVs). Overall, 3D packaging enhances speed, reduces power consumption, and saves space, enabling more powerful and efficient electronic devices such as smartphones, servers, and high-performance computing systems.