3D ICs (Three-Dimensional Integrated Circuits)

3D ICs, or Three-Dimensional Integrated Circuits, are advanced electronic chips where multiple layers of circuits are stacked vertically, rather than spread out flat. This stacking allows for closer connections between components, leading to faster data transfer, reduced size, and improved performance. Essentially, they pack more processing power into a smaller space by building upward, much like a multi-layered sandwich, rather than outward on a single flat sheet. This technology is used in high-performance computers, smartphones, and data centers to enable faster, more efficient electronic devices.