3D ICs

3D integrated circuits (3D ICs) are advanced electronic chips where multiple layers of electronic components are stacked vertically, rather than spread out on a flat surface. This stacking allows for shorter connections between components, leading to faster data transfer, reduced power consumption, and a smaller overall size. Think of it like stacking multiple layers of a building to save space and improve efficiency. 3D ICs are used in high-performance computing, smartphones, and data centers to enable more powerful, compact, and energy-efficient devices.